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May 18 - 20, 2023
hosted by Lewis University
Romeoville, IL, USA


IEEE logo 2023 IEEE INTERNATIONAL CONFERENCE on
ELECTRO/INFORMATION TECHNOLOGY

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Tour of Panduit's Jack E. Caveney Innovation Center

Thursday, May 18, 2023
2:00 PM - 4:00 PM
Shuttle will leave Lewis University at 1:00 PM from Parking Lot D
 
Panduit is a global manufacturer of data center, enterprise, industrial automation, and electrical products headquartered in Tinley Park, IL. The Jack E. Caveney Innovation Center (JECIC) was named after its founder, one of the most prolific inventors in the electrical and telecommunications-oriented industries. The JECIC innovation is a sleek, high-tech state of the art research center containing over 17 labs in a 250k square foot facility. At the JECIC facility, Panduit fosters creative thinking and looks ahead into the future to be able to meet the technological demands of the information age. Research and Development performed in this facility include thermal, electrical, optical, software, industrial automation, networking, and mechanical research.