May 18 - 20, 2023
Lewis University, Romeoville, IL
Paper Submission Deadline: March 31, 2023*
R4 Conferences Administrator
James Riess
EIT Conferences Founding General Chair
Hossein Mousavinezhad
Idaho State University
2023 Conference General Co-Chair
Gina Martinez
Bakul Banerjee
Program Chairs
Constantin Apostoaia
Subra Ganesan
Osama Abuomar
Ibrahim Abdel-Motaleb
Finance Chair
Steve Kerchberger
Professional Development Program Chair
Tarek Ladhiri
Ray Klump
Exhibits/Industry/Sponsorship Chair
Hamid Vakilzadian
Bakul Banerjee
Publicity Chair
Alvin Chin
Local Arrangements Chair
Matt Plass
Registration Chair
Mahmood Al-Khassaweneh
Student Activities Chair
Sasidhar Tadanki
Publications Chairs
Afshin Izadian, IUPUI
Rahul Gomes
International Liaisons
Chengying Xu
Peter Dittrich
Hongwei Zhang
Hsiao-Hwa Chen
EIT 2023 Webmaster
Bob Evanich
Awards Chairs
Sat Basu
Hossein Mousavinezhad
Subra Ganesan


The IEEE 2023 International Electro/Information Technology Conference, sponsored by the IEEE Region 4 (R4), in collaboration with Lewis University, and the IEEE Chicago Section., is focused on basic/applied research results in the fields of electrical and computer engineering as they relate to Electrical and Computer Engineering, Information Technology, and related applications. The purpose of the conference is to provide a forum for researchers and industrial investigators to exchange ideas and discuss developments in these growing fields. There will also be exhibits where the latest electro/information technology tools and products will be showcased. This is also an opportunity for professional activities development, workshops and tutorials.


Topics of interest include but are not limited to:

  • Robotics and Mechatronics
  • Intelligent Systems and Multi-agent Systems
  • Control Systems and System Identification
  • Reconfigurable and Embedded Systems
  • Power Systems and Power Electronics
  • Solid State, Consumer and Automotive Electronics
  • Electronic Design Automation
  • Biomedical Applications, Telemedicine
  • Biometrics and Bioinformatics
  • Nanotechnology
  • Micro Electromechanical Systems
  • Electric Vehicles
  • Wireless Communications and Networking
  • Ad Hoc and Sensor Networks
  • Internet of Things
  • Artificial Intelligence and Machine Learning
  • Cybersecurity
  • Computer Vision
  • Signal/Image and Video Processing
  • Distributed Data Fusion and Mining
  • Cloud, Mobile, and Distributed Computing
  • Software Engineering and Middleware Architecture
  • Engineering Education and Engineering Management

Important dates:

  • Submission of full papers: March 31, 2023
  • Notification of acceptance: April 21, 2023
  • Final manuscript (PDF) due: April 28, 2023
  • Early registration: April 30, 2023

For more information, ideas for organizing/chairing sessions, industry participation, tutorials, professional activities sessions, please contact:

*" International participants who need visa to enter the US are encouraged to submit their papers by Feb. 15, 2023. This will allow us to review their papers and send them the invitation letters earlier."